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 OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
FEATURES
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IDT82V2048L
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Octal T1/E1 short haul analog front end which supports 100 T1 twisted pair, 120 E1 twisted pair and 75 E1 coaxial applications Built-in transmit pre-equalization meets G.703 & T1.102 Digital/Analog LOS detector meets ITU G.775, ETS 300 233 and T1.231 ITU G.772 non-intrusive monitoring for in-service testing for any one of channel 1 to channel 7 Low impedance transmit drivers with high-Z Selectable hardware and parallel/serial host interface
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Hitless Protection Switching (HPS) for 1 to 1 protection without relays JTAG boundary scan for board test 3.3 V supply with 5 V tolerant I/O Low power consumption Operating temperature range: -40C to +85C Available in 144-pin Thin Quad Flat Pack (TQFP) and 160-pin Plastic Ball Grid Array (PBGA) packages Green package options available
FUNCTIONAL BLOCK DIAGRAM
LOS Detector RTIPn RRINGn Peak Detector TTIPn TRINGn Line Driver Waveform Shaper Transmit All Ones G.772 Monitor Clock Generator Control Interface Slicer
One of Eight Identical Channels LOSn RCn RDPn RDNn
TCLKn TDPn TDNn
Register File
JTAG TAP
VDDIO VDDT VDDD VDDA
OE CLKE MODE[2:0] CS TS2/SCLK/ALE/AS TS1/RD/R/W TS0/SDI/WR/DS SDO/RDY/ACK INT D[7:0]/AD[7:0] MC[3:0]/A[4:0]
MCLK
Figure-1 Block Diagram
TRST TCK TMS TDI TDO
IDT and the IDT logo are trademarks of Integrated Device Technology, Inc.
July, 2005 1
DSC-6527/1
2005 Integrated Device Technology, Inc.
IDT82V2048L OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
INDUSTRIAL TEMPERATURE RANGES
PIN CONFIGURATIONS
TDP4 TCLK4 LOS5 RDN5 RDP5 RC5 TDN5 TDP5 TCLK5 TDI TDO TCK TMS TRST IC IC VDDIO GNDIO VDDA GNDA MODE0 CS TS2/SCLK/ALE/AS TS1/RD/R/W TS0/SDI/WR/DS SDO/RDY/ACK INT TCLK2 TDP2 TDN2 RC2 RDP2 RDN2 LOS2 TCLK3 TDP3 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73
TDP7 TCLK7 LOS6 RDN6 RDP6 RC6 TDN6 TDP6 TCLK6 MCLK MODE2 A4 MC3/A3 MC2/A2 MC1/A1 MC0/A0 VDDIO GNDIO VDDD GNDD D0/AD0 D1/AD1 D2/AD2 D3/AD3 D4/AD4 D5/AD5 D6/AD6 D7/AD7 TCLK1 TDP1 TDN1 RC1 RDP1 RDN1 LOS1 TCLK0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
TDN4 RC4 RDP4 RDN4 LOS4 OE CLKE VDDT4 TTIP4 TRING4 GNDT4 RTIP4 RRING4 GNDT5 TRING5 TTIP5 VDDT5 RRING5 RTIP5 VDDT6 TTIP6 TRING6 GNDT6 RTIP6 RRING6 GNDT7 TRING7 TTIP7 VDDT7 RRING7 RTIP7 LOS7 RDN7 RDP7 RC7 TDN7
109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144
IDT82V2048L (Top View)
72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37
TDN3 RC3 RDP3 RDN3 LOS3 RTIP3 RRING3 VDDT3 TTIP3 TRING3 GNDT3 RRING2 RTIP2 GNDT2 TRING2 TTIP2 VDDT2 RTIP1 RRING1 VDDT1 TTIP1 TRING1 GNDT1 RRING0 RTIP0 GNDT0 TRING0 TTIP0 VDDT0 MODE1 LOS0 RDN0 RDP0 RC0 TDN0 TDP0
Figure-2 TQFP144 Package Pin Assignment
2
IDT82V2048L OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
INDUSTRIAL TEMPERATURE RANGES
A 1 2 3 4 5 6 7 8 9 10 11 12 13 14
B TCLK 7 TDP 7 TDN 7 VDDT 7 TTIP 7
C
D
E
F MC 1 MC 2 MC 3 A4
G
H
J
K
L TCLK 1 TDP 1 TDN 1 VDDT 1 TTIP 1
M
N TCLK 0 TDP 0 TDN 0 VDDT 0 TTIP 0
P 1 2 3 4 5 6 7 8 9 10 11 12 13 14
RC7 RDP 7 RDN 7 VDDT 7 TRING 7
RC6 RDP 6 RDN 6 VDDT 6 TRING 6
TCLK MCLK 6 TDP 6 TDN 6 VDDT 6 TTIP 6 MODE 2 LOS 6 LOS 7
VDDIO VDDD D0 MC 0 D2 D1
D6 D5 D4 D3
D7 MODE 1 LOS 1 LOS 0
RC1 RDP 1 RDN 1 VDDT 1 TRING 1
RC0 RDP 0 RDN 0 VDDT 0 TRING 0
GNDIO GNDD
GNDT GNDT GNDT GNDT 7 7 6 6 RTIP 7 RTIP 4 RRING 7 RRING 4 RTIP 6 RTIP 5 RRING 6 RRING 5
GNDT GNDT GNDT GNDT 1 1 0 0
IDT82V2048L (Bottom View)
RRING 1 RRING 2
RTIP 1 RTIP 2
RRING 0 RRING 3
RTIP 0 RTIP 3
GNDT GNDT GNDT GNDT 4 4 5 5 TRING 4 VDDT 4 RDN 4 RDP 4 RC4 A TTIP 4 VDDT 4 TDN 4 TDP 4 TCLK 4 B TRING 5 VDDT 5 RDN 5 RDP 5 RC5 C TTIP 5 VDDT 5 TDN 5 TDP 5 TCLK 5 D LOS 4 LOS 5 CLKE OE E TMS TDI TDO TCK F GNDIO GNDA TRST IC MODE 0 IC CS TS 2 TS 1 TS 0 J LOS 3 LOS 2 INT SDO K
GNDT GNDT GNDT GNDT 2 2 3 3 TTIP 2 VDDT 2 TDN 2 TDP 2 TCLK 2 L TRING 2 VDDT 2 RDN 2 RDP 2 RC2 M TTIP 3 VDDT 3 TDN 3 TDP 3 TCLK 3 N TRING 3 VDDT 3 RDN 3 RDP 3 RC3 P
VDDIO VDDA G H
Figure-3 PBGA160 Package Pin Assignment
3
IDT82V2048L OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
INDUSTRIAL TEMPERATURE RANGES
1
PIN DESCRIPTION
Table-1 Pin Description
Name Type Pin No. TQFP144 PBGA160 Transmit and Receive Line Interface TTIP0 TTIP1 TTIP2 TTIP3 TTIP4 TTIP5 TTIP6 TTIP7 TRING0 TRING1 TRING2 TRING3 TRING4 TRING5 TRING6 TRING7 RTIP0 RTIP1 RTIP2 RTIP3 RTIP4 RTIP5 RTIP6 RTIP7 RRING0 RRING1 RRING2 RRING3 RRING4 RRING5 RRING6 RRING7 45 52 57 64 117 124 129 136 46 51 58 63 118 123 130 135 48 55 60 67 120 127 132 139 49 54 61 66 121 126 133 138 N5 L5 L10 N10 B10 D10 D5 B5 P5 M5 M10 P10 A10 C10 C5 A5 P7 M7 M8 P8 A8 C8 C7 A7 N7 L7 L8 N8 B8 D8 D7 B7 Description
Analog Output
TTIPn/TRINGn: Transmit Bipolar Tip/Ring for Channel 0~7 These pins are the differential line driver outputs. They will be in high impedance state if pin OE is low or the corresponding pin TCLKn is low (pin OE is global control, while pin TCLKn is per-channel control). In host mode, each pin can be in high impedance by programming a `1' to the corresponding bit in register OE(1).
Analog Input
RTIPn/RRINGn: Receive Bipolar Tip/Ring for Channel 0~7 These pins are the differential line receiver inputs.
1. Register name is indicated by bold capital letter. For example, OE indicates Output Enable Register.
4
IDT82V2048L OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
INDUSTRIAL TEMPERATURE RANGES
Table-1 Pin Description (Continued)
Name Type Pin No. TQFP144 PBGA160 Description Transmit and Receive Digital Data Interface TDP0 TDP1 TDP2 TDP3 TDP4 TDP5 TDP6 TDP7 I TDN0 TDN1 TDN2 TDN3 TDN4 TDN5 TDN6 TDN7 TCLK0 TCLK1 TCLK2 TCLK3 TCLK4 TCLK5 TCLK6 TCLK7 RDP0 RDP1 RDP2 RDP3 RDP4 RDP5 RDP6 RDP7 RDN0 RDN1 RDN2 RDN3 RDN4 RDN5 RDN6 RDN7 RC0 RC1 RC2 RC3 RC4 RC5 RC6 RC7 38 31 79 72 109 102 7 144 36 29 81 74 107 100 9 2 40 33 77 70 111 104 5 142 41 34 76 69 112 105 4 141 39 32 78 71 110 103 6 143 N3 L3 L12 N12 B12 D12 D3 B3 N1 L1 L14 N14 B14 D14 D1 B1 P2 M2 M13 P13 A13 C13 C2 A2 P3 M3 M12 P12 A12 C12 C3 A3 P1 M1 M14 P14 A14 C14 C1 A1 37 30 80 73 108 101 8 1 N2 L2 L13 N13 B13 D13 D2 B2
TDPn/TDNn: Positive/Negative Transmit Data for Channel 0~7 The NRZ data to be transmitted for positive/negative pulse is input on this pin. Data on TDPn/TDNn are active high and are sampled on the falling edges of TCLKn. TDPn 0 0 1 1 TDNn 0 1 0 1 Output Pulse Space Negative Pulse Positive Pulse Space
I
TCLKn: Transmit Clock for Channel 0~7 The clock of 1.544 MHz (for T1 mode) or 2.048 MHz (for E1 mode) for transmit is input on this pin. The transmit data at TDPn or TDNn is sampled into the device on the falling edges of TCLKn. Different combinations of TCLKn and MCLK result in different transmit mode. It is summarized as Table-2 System Interface Configuration.
O High Impedance
RDPn/RDNn: Positive/Negative Receive Data for Channel 0~7 These pins output the raw RZ sliced data. The active polarity of RDPn/RDNn is determined by pin CLKE. When pin CLKE is low, RDPn/RDNn is active low. When pin CLKE is high, RPDn/RDNn is active high. RDPn/RDNn will remain active during LOS. RDPn/RDNn is set into high impedance when the corresponding receiver is powered down.
O High Impedance
RCn: Receive Pulse for Channel 0~7 RCn is the output of an internal exclusive OR (XOR) which is connected with RDPn and RDNn. The clock is recovered from the signal on RCn. If receiver n is powered down, the corresponding RCn will be in high impedance.
5
IDT82V2048L OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
INDUSTRIAL TEMPERATURE RANGES
Table-1 Pin Description (Continued)
Name Type Pin No. TQFP144 PBGA160 Description MCLK: Master Clock This is an independent, free running reference clock. A clock of 1.544 MHz (for T1 mode) or 2.048 MHz (for E1 mode) is supplied to this pin as the clock reference of the device for normal operation. When MCLK is low, all the receivers are powered down, and the output pins RCn, RDPn and RDNn are switched to high impedance. In transmit path, the operation mode is decided by the combination of MCLK and TCLKn (See Table-2 System Interface Configuration for details). NOTE: Wait state generation via RDY/ACK is not available if MCLK is not provided. LOSn: Loss of Signal Output for Channel 0~7 A high level on this pin indicates the loss of signal when there is no transition over a specified period of time or no enough ones density in the received signal. The transition will return to low automatically when there is enough transitions over a specified period of time with a certain ones density in the received signal. The LOS assertion and desertion criteria are described in 2.4.3 Loss of Signal (LOS) Detection.
MCLK
I
10
E1
LOS0 LOS1 LOS2 LOS3 LOS4 LOS5 LOS6 LOS7
O
42 35 75 68 113 106 3 140
K4 K3 K12 K11 E11 E12 E3 E4
Hardware/Host Control Interface MODE2: Control Mode Select 2(2) The signal on this pin determines which control mode is selected to control the device: MODE2 Low VDDIO/2 High I MODE2 (Pulled to VDDIO/2) 11 E2 Control Interface Hardware Mode Serial Host Interface Parallel Host Interface
Hardware control pins include MODE[2:0], TS[2:0], CLKE and OE. Serial host Interface pins include CS, SCLK, SDI, SDO and INT. Parallel host Interface pins include CS, A[4:0], D[7:0], WR/DS, RD/R/W, ALE/AS, INT and RDY/ACK. The device supports multiple parallel host interface as follows (refer to MODE1 and MODE0 pin descriptions below for details): MODE[2:0] 100 101 110 111 Host Interface Non-multiplexed Motorola Mode Interface Non-multiplexed Intel Mode Interface Multiplexed Motorola Mode Interface Multiplexed Intel Mode Interface
MODE1
I
43
K2
MODE1: Control Mode Select 1(2) In parallel host mode, the parallel interface operates with separate address bus and data bus when this pin is low, and operates with multiplexed address and data bus when this pin is high. In serial host mode or hardware mode, this pin should be grounded. MODE0: Control Mode Select 0(2) In parallel host mode, the parallel host interface is configured for Motorola compatible hosts when this pin is low, or for Intel compatible hosts when this pin is high. In serial host mode or hardware mode, this pin should be grounded. CS: Chip Select (Active Low) In host mode, this pin is asserted low by the host to enable host interface. A high to low transition must occur on this pin for each read/write operation and the level must not return to high until the operation is over. In hardware control mode, this pin should be pulled to VDDIO/2.
MODE0
I
88
H12
I CS (Pulled to VDDIO/2) 87 J11
2. In host mode, register e-AFE has to be set to `FFH' for proper device operation. See Expanded Register Description on page 28 for more details.
6
IDT82V2048L OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
INDUSTRIAL TEMPERATURE RANGES
Table-1 Pin Description (Continued)
Name Type Pin No. TQFP144 PBGA160 Description TS2: Template Select 2 In hardware control mode, the signal on this pin is the most significant bit for the transmit template select. Refer to 2.5.1 Waveform Shaper for details. SCLK: Shift Clock In serial host mode, the signal on this pin is the shift clock for the serial interface. Data on pin SDO is clocked out on falling edges of SCLK if pin CLKE is high, or on rising edges of SCLK if pin CLKE is low. Data on pin SDI is always sampled on rising edges of SCLK. ALE: Address Latch Enable In parallel Intel multiplexed host mode, the address on AD[4:0] is sampled into the device on the falling edges of ALE (signals on AD[7:5] are ignored). In non-multiplexed host mode, ALE should be pulled high. AS: Address Strobe (Active Low) In parallel Motorola multiplexed host mode, the address on AD[4:0] is latched into the device on the falling edges of AS (signals on AD[7:5] are ignored). In non-multiplexed host mode, AS should be pulled high. TS1: Template Select 1 In hardware control mode, the signal on this pin is the second most significant bit for the transmit template select. Refer to 2.5.1 Waveform Shaper for details. TS1/RD/R/W I 85 J13 RD: Read Strobe (Active Low) In parallel Intel multiplexed or non-multiplexed host mode, this pin is active low for read operation. R/W: Read/Write Select In parallel Motorola multiplexed or non-multiplexed host mode, the pin is active low for write operation and high for read operation. TS0: Template Select 0 In hardware control mode, the signal on this pin is the least significant bit for the transmit template select. Refer to 2.5.1 Waveform Shaper for details. SDI: Serial Data Input In serial host mode, this pin input the data to the serial interface. Data on this pin is sampled on the rising edges of SCLK. TS0/SDI/WR/ DS WR: Write Strobe (Active Low) In parallel Intel host mode, this pin is active low during write operation. The data on D[7:0] (in non-multiplexed mode) or AD[7:0] (in multiplexed mode) is sampled into the device on the rising edges of WR. DS: Data Strobe (Active Low) In parallel Motorola host mode, this pin is active low. During a write operation (R/W = 0), the data on D[7:0] (in non-multiplexed mode) or AD[7:0] (in multiplexed mode) is sampled into the device on the rising edges of DS. During a read operation (R/W = 1), the data is driven to D[7:0] (in non-multiplexed mode) or AD[7:0] (in multiplexed mode) by the device on the rising edges of DS. In parallel Motorola non-multiplexed host mode, the address information on the 5 bits of address bus A[4:0] are latched into the device on the falling edges of DS.
TS2/SCLK/ ALE/AS
I
86
J12
I
84
J14
7
IDT82V2048L OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
INDUSTRIAL TEMPERATURE RANGES
Table-1 Pin Description (Continued)
Name Type Pin No. TQFP144 PBGA160 Description SDO: Serial Data Output In serial host mode, the data is output on this pin. In serial write operation, SDO is always in high impedance. In serial read operation, SDO is in high impedance only when SDI is in address/command byte. Data on pin SDO is clocked out of the device on the falling edges of SCLK if pin CLKE is high, or on the rising edges of SCLK if pin CLKE is low. SDO/RDY/ACK O 83 K14 RDY: Ready Output In parallel Intel host mode, the high level of this pin reports to the host that bus cycle can be completed, while low reports the host must insert wait states. ACK: Acknowledge Output (Active Low) In parallel Motorola host mode, the low level of this pin indicates that valid information on the data bus is ready for a read operation or acknowledges the acceptance of the written data during a write operation. INT D7/AD7 D6/AD6 D5/AD5 D4/AD4 D3/AD3 D2/AD2 D1/AD1 D0/AD0 O Open Drain I/O 82 28 27 26 25 24 23 22 21 K13 K1 J1 J2 J3 J4 H2 H3 G2 INT: Interrupt (Active Low) This is an open drain, active low interrupt output. Two sources may cause the interrupt. Refer to 2.19 Interrupt Handling for details. Dn: Data Bus 7~0 In non-multiplexed host mode, these pins are the bi-directional data bus. ADn: Address/Data Bus 7~0 In multiplexed host mode, these pins are the multiplexed bi-directional address/data bus. In hardware mode, these pins should be tied to VDDIO/2. In serial host mode, these pins should be grounded.
High Impedance
8
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INDUSTRIAL TEMPERATURE RANGES
Table-1 Pin Description (Continued)
Name Type Pin No. TQFP144 PBGA160 Description MCn: Performance Monitor Configuration 3~0 In hardware control mode, A4 must be connected to GND. MC[3:0] are used to select a transmitter or receiver of channel 1 to 7 for non-intrusive monitoring. Channel 0 is used as the monitoring channel. If a transmitter is monitored, signals on the corresponding pins TTIPn and TRINGn are internally transmitted to RTIP0 and RRING0 pins. If a receiver is monitored, signals on the corresponding pins RTIPn and RRINGn are internally transmitted to RTIP0 and RRING0 pins. The monitored is then output to RDP0 and RDN0 pins. Performance Monitor Configuration determined by MC[3:0] is shown below. Note that if MC[2:0] = 000, the device is in normal operation of all the channels. MC[3:0] Monitoring Configuration 0000 Normal operation without monitoring 0001 Monitor Receiver 1 0010 Monitor Receiver 2 0011 Monitor Receiver 3 0100 Monitor Receiver 4 0101 Monitor Receiver 5 0110 Monitor Receiver 6 0111 Monitor Receiver 7 1000 Normal operation without monitoring 1001 Monitor Transmitter 1 1010 Monitor Transmitter 2 1011 Monitor Transmitter 3 1100 Monitor Transmitter 4 1101 Monitor Transmitter 5 1110 Monitor Transmitter 6 Monitor Transmitter 7 1111 In host mode operation, the monitoring channel is selected in the PMON register. The signals monitored by channel 0 can be routed to TTIP0/RING0 by activating the remote loopback in this channel (refer to 2.13 G.772 Monitoring). An: Address Bus 4~0 When pin MODE1 is low, the parallel host interface operates with separate address and data bus. In this mode, the signal on this pin is the address bus of the host interface. When pin MODE1 is high or in serial host mode, these pins should be tied to GND. OE I 114 E14 OE: Output Driver Enable Pulling this pin low can drive all driver output into high impedance for redundancy application without external mechanical relays. In this condition, all other internal circuits remain active. CLKE: Clock Edge Select The signal on this pin determines the active edge of RCn, RDPn, RDNn and SCLK. Refer to 2.3 Clock Edges for details. JTAG Signals I TRST Pull-up I TMS Pull-up 96 F11 95 G12 TRST: JTAG Test Port Reset (Active Low) This is the active low asynchronous reset to the JTAG Test Port. This pin has an internal pull-up resistor and can be left disconnected. TMS: JTAG Test Mode Select The signal on this pin controls the JTAG test performance and is clocked into the device on the rising edges of TCK. This pin has an internal pull-up resistor and can be left disconnected. TCK: JTAG Test Clock The clock of the JTAG test is input on this pin. The data on TDI and TMS are clocked into the device on rising edges of TCK while the data on TDO pin is clocked out of the device on falling edges of TCK. This pin should be connected to GNDIO or VDDIO pin when unused.
A4 MC3/A3 MC2/A2 MC1/A1 MC0/A0
I
12 13 14 15 16
F4 F3 F2 F1 G3
CLKE
I
115
E13
TCK
I
97
F14
9
IDT82V2048L OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
INDUSTRIAL TEMPERATURE RANGES
Table-1 Pin Description (Continued)
Name Type O TDO High Impedance I TDI Pull-up 99 F12 98 F13 Pin No. TQFP144 PBGA160 Description TDO: JTAG Test Data Output The serial data of the JTAG test is output on this pin. The data on TDO pin is clocked out of the device on the falling edges of TCK. TDO is a high impedance output signal. It is active only when scanning of data is over. This pin should be left float when unused. TDI: JTAG Test Data Input The serial data of the JTAG test is input on this pin. The data on TDI pin is clocked into the device on the rising edges of TCK. This pin has an internal pull-up resistor and it can be left disconnected. Power Supplies and Grounds VDDIO GNDIO VDDT0 VDDT1 VDDT2 VDDT3 VDDT4 VDDT5 VDDT6 VDDT7 GNDT0 GNDT1 GNDT2 GNDT3 GNDT4 GNDT5 GNDT6 GNDT7 VDDD VDDA GNDD GNDA 17 92 18 91 44 53 56 65 116 125 128 137 47 50 59 62 119 122 131 134 19 90 20 89 G1 G14 G4 G11 N4, P4 L4, M4 L11, M11 N11, P11 A11, B11 C11, D11 C4, D4 A4, B4 N6, P6 L6, M6 L9, M9 N9, P9 A9, B9 C9, D9 C6, D6 A6, B6 H1 H14 H4 H11 3.3 V I/O Power Supply I/O GND
-
3.3 V/5 V Power Supply for Transmitter Driver All VDDT pins must be connected to 3.3 V or all VDDT must be connected to 5 V. It is not allowed to leave any of the VDDT pins open (not-connected) even if the channel is not used. T1 is only 5V VDDT.
-
Analog GND for Transmitter Driver
-
3.3 V Digital/Analog Core Power Supply Digital/Analog Core GND Others
IC IC
-
93 94
G13 H13
IC: Internal Connection Internal use. Leave it open for normal operation. IC: Internal Connection Internal use. Leave it open for normal operation.
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IDT82V2048L OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
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2
2.1
FUNCTIONAL DESCRIPTION
OVERVIEW
The IDT82V2048L is a fully integrated octal short-haul analog front end (AFE), which contains eight transmit and receive channels for use in either T1 or E1 applications. The raw sliced data (no retiming) is output to the system. Transmit equalization is implemented with low-impedance output drivers that provide shaped waveforms to the transformer, guaranteeing template conformance. Moreover, testing functions, such as JTAG boundary scan is provided. The device is optimized for flexible software control through a serial or parallel host mode interface. Hardware control is also available. Figure-1 on page 1 shows one of the eight identical channels operation.
The Dual Rail interface consist of TDPn1, TDNn, TCLKn, RDPn, RDNn and RCn. Data transmitted from TDPn and TDNn appears on TTIPn and TRINGn at the line interface. The interface of the AFE is shown in Figure-4. Pin RDPn and RDNn, are raw RZ slice outputs and internally connected to an XOR which is fed to the RCn output for external clock recovery applications. 2.2.1.1 SYSTEM INTERFACE CONFIGURATION For normal transmit and receive operation, the device is configured as follows: In host mode, MCLK can be either clocked or pulled high. If MCLK is pulled high, TCLK1 has to be provided for proper device operation. In addition, register e-AFE2 has to be set to `FFH' to ensure proper device operation. See Expanded Register Description on page 28 for details. In hardware mode, MCLK has to be pulled high and TCLK1 has to be provided for proper device operation. Depending on the state of TCLK1 and TCLKn, the transmitter will Transmit All Ones (TAOS), will go into power down, or will go into high impedance. The status of TCLK1 and TCLKn has no effect on the receive paths. By setting MCLK low, all the receive paths are powered down. Table-2 summarizes the different combinations between MCLK and TCLKn.
1. 2.
2.2
T1/E1 MODE SELECTION
T1/E1 mode selection configures the device globally. In Hardware control Mode, the template selection pins TS[2:0], determine whether the operation mode is T1 or E1 (see Table-5 on page 14). In Software Mode, the register TS determines whether the operation mode is T1 or E1. 2.2.1 SYSTEM INTERFACE The system interface of each channel operates in Dual Rail Mode with data recovery, that is, with raw data slicing only and without clock recovery.
The footprint `n' (n = 0 - 7) indicates one of the eight channels. The first letter `e-' indicates expanded register.
11
IDT82V2048L OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
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Table-2 System Interface Configuration
Host or Hardware Mode MCLK TCLK1 TCLKn AFEn in e-AFE Transmitter Mode
Transmit and Receive Normal Operation Host(1) only Host or Hardware(2) Clocked High Clocked Clocked Clocked Clocked 1 DC
(3)
Normal operation Normal operation
Transmit Interface Modes High ( 16 MCLK) Low ( 64 MCLK) TCLKn is high ( 16 TCLK1) TCLKn is low ( 64 TCLK1) TCLK1 is unavailable. DC Receive Interface Modes Host or Hardware
1.
Host only
Clocked
1
Transmit All Ones (TAOS) signals to the line side in the corresponding transmit channel. Corresponding transmit channel is set into power down state. Transmit All Ones (TAOS) signals to the line side in the corresponding transmit channel.
TCLK1 is clocked Host or Hardware High/Low
DC
Corresponding transmit channel is set into power down state. All eight transmitters (TTIPn & TRINGn) are in high impedance.
Low
The receive path is not affected by the status of TCLK1 or TCLKn.
DC
All the receive paths are powered down.
In host mode, register e-AFE must be set to `FFH' for proper operation. See Expanded Register Description on page 28 for details.
2. In hardware mode, MCLK must be pulled high and TCLK1 provided for proper operation. 3. DC means Don't Care
LOS Detector RTIPn RRINGn Peak Detector TTIPn TRINGn Line Driver Waveform Shaper Transmit All Ones Slicer
One of Eight Identical Channels LOSn RCn RDPn RDNn
TCLKn TDPn TDNn
Figure-4 Analog Front End (AFE) Interface
12
IDT82V2048L OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
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2.3
CLOCK EDGES
The active edge of SCLK is selectable. If pin CLKE is high, the active edge of SCLK is the falling edge. On the contrary, if CLKE is low, the active edge SCLK is the rising edge. Pin SDO is always active high, and the output signals are valid on the active edge of SCLK. See Table-3 Active Clock Edge and Active Level for details. Pin CLKE is used to set the active level for RDPn/RDNn raw slicing output: high for active high polarity and low for active low. It should be noted that data on pin SDI are always active high and are sampled on the rising edges of SCLK. The data on pin TDPn or TDNn are also always active high but are sampled on the falling edges of TCLKn, despite the level on CLKE. Table-3 Active Clock Edge and Active Level
Pin CLKE High Pin RDPn and RDNn Slicer Output Active High SCLK Pin SDO Active High
Low
Active Low
SCLK
Active High
2.4
RECEIVER
In receive path, the line signals couple into RRINGn and RTIPn via a transformer and are converted into RZ digital pulses by a data slicer. Adaptation for attenuation is achieved using an integral peak detector that sets the slicing levels. The recovered data on pin RDPn/RDNn in an undecoded dual rail RZ format. Loss of signal is detected. This change in status may be enabled to generate an interrupt. 2.4.1 PEAK DETECTOR AND SLICER The slicer determines the presence and polarity of the received pulses. The raw positive slicer output appears on RDPn while the negative slicer output appears on RDNn. The slicer circuit has a built-in peak detector from which the slicing threshold is derived. The slicing threshold is default to 50% (typical) of the peak value. Signals with an attenuation of up to 12 dB (from 2.4 V) can be recovered by the receiver. To provide immunity from impulsive noise, the peak detectors are held above a minimum level of 0.150 V typically, despite the received signal level. Table-4 LOS Condition
2.4.2 DATA RECOVERY The analog line signal are converted to RZ digital bit streams on the RDPn/RDNn pins and internally connected to an XOR which is fed to the RCn output for external clock recovery applications. 2.4.3 LOSS OF SIGNAL (LOS) DETECTION The Loss of Signal Detector monitors the amplitude and density of the received signal on receiver line before the transformer (measured on port A, B shown in Figure-7). The loss condition is reported by pulling pin LOSn high. At the same time, LOS alarm registers track LOS condition. When LOS is detected or cleared, an interrupt will generate if not masked. In host mode, the detection supports the ANSI T1.231 for T1 mode, ITU G.775 and ETSI 300 233 for E1 mode. In hardware mode, it supports the ITU G.775 and ANSI T1.231. Table-4 summarizes the conditions of LOS. During LOS, the RDPn/ RDNn continue to output the sliced data.
Standard ANSI T1.231 for T1 LOS Detected LOS Cleared
1.
G.775 for E1 32 below typical 200 mVp
ETSI 300 233 for E1 2048 (1 ms) below typical 200 mVp 12.5% (4 marks in a sliding 32-bit period) with no more than 15 continuous zeros exceed typical 250 mVp
Signal on LOSn High
Continuous Intervals Amplitude(1) Density Amplitude(1)
175 below typical 200 mVp
12.5% (16 marks in a sliding 128-bit 12.5% (4 marks in a sliding 32-bit period) with no more than 99 contin- period) with no more than 15 conuous zeros tinuous zeros exceed typical 250 mVp exceed typical 250 mVp
Low
LOS levels at device (RTIPn, RRINGn) with all ones signal. For more detail regarding the LOS parameters, please refer to Receiver Characteristics on page 38.
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1.2 1 0.8 Normalized Amplitude 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 0 250 500 Time (ns) 750 1000 1250
2.5
TRANSMITTER
In transmit path, data in NRZ format is clocked into the device on TDPn and TDNn. The data is sampled into the device on falling edges of TCLKn. The shape of the pulses are user programmable to ensure that the T1/E1 pulse template is met after the signal passes through different cable lengths or types. 2.5.1 WAVEFORM SHAPER T1 pulse template, specified in the DSX-1 Cross-Connect by ANSI T1.102, is illustrated in Figure-5. The device has built-in transmit waveform templates, corresponding to 5 levels of pre-equalization for cable of a length from 0 to 655 ft with each increment of 133 ft. E1 pulse template, specified in ITU-T G.703, is shown in Figure-6. The device has built-in transmit waveform templates for cable of 75 or 120 . Any one of the six built-in waveforms can be chosen in both hardware mode and host mode. In hardware control mode, setting pins TS[2:0] can select the required waveform template for all the transmitters, as shown in Table-5. In host mode, the waveform template can be configured on a per-channel basis. Bits TSIA[2:0] in register TSIA are used to select the channel and bits TS[2:0] in register TS are used to select the required waveform template. The built-in waveform shaper uses an internal high frequency clock which is 16XMCLK as the clock reference. This function will be bypassed when MCLK is unavailable.
Figure-5 DSX-1 Waveform Template
1.20
1.00
0.80 Normalized Amplitude
0.60
0.40
0.20
0.00
-0.20
-300
-200
-100
0 Time (ns)
100
200
300
Figure-6 CEPT Waveform Template Table-5 Built-in Waveform Template Selection
TS2 0 0 0 0 1 1 1 1 TS1 0 0 1 1 0 0 1 1 TS0 0 1 0 1 0 1 0 1 Service E1 Clock Rate 2.048 MHz Cable Length 120 /75 Cable Reserved 0-133 ft. ABAM 133-266 ft. ABAM 266-399 ft. ABAM 399-533 ft. ABAM 533-655 ft. ABAM 0.6 1.2 1.8 2.4 3.0 Maximum Cable Loss (dB)(1) -
T1
1.544 MHz
1.
Maximum cable loss at 772 kHz.
2.6
LINE INTERFACE CIRCUITRY
The transmit and receive interface RTIPn/RRINGn and TTIPn/ TRINGn connections provide a matched interface to the cable. Figure-7 shows the appropriate external components to connect with the cable for one transmit/receive channel. Table-6 summarizes the component values based on the specific application.
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Table-6 External Components Values
Component 75 Coax 9.5 1% 9.31 1% T1 100 Twisted Pair, VDDT = 5.0 V 9.1 1% 12.4 1% 2200 pF 1000 pF Nihon Inter Electronics - EP05Q03L, 11EQS03L, EC10QS04, EC10QS03L; Motorola - MBR0540T1 120 Twisted Pair 9.5 1% 15 1%
One of Eight Identical Channels * 0.22 F * * 2:1 ** TX Line Cp
2 1
E1
RT RR
Cp D1 - D4
A
RX Line
2:1 **
1
1 k RR
RTIPn
B
1 k VDDT D4 RT D3 VDDT D2 RT D1
RRINGn * TTIPn
IDT82V2048L
RR
VDDT VDDDn 0.1 F GNDTn
*
*
68 F3
*
TRINGn
NOTE: 1. Pulse T1124 transformer is recommended to be used in Standard (STD) operating temperature range (0C to 70C), while Pulse T1114 transformer is recommended to be used in Extended (EXT) operating temperature range is -40C to +85C. See Transformer Specifications Table for details. 2. Typical value. Adjust for actual board parasitics to obtain optimum return loss. 3. Common decoupling capacitor for all VDDT and GNDT pins. One per chip.
Figure-7 External Transmit/Receive Line Circuitry
2.7
TRANSMIT DRIVER POWER SUPPLY
All transmit driver power supplies must be 5.0 V or 3.3 V. In E1 mode, despite the power supply voltage, the 75 /120 lines are driven through a pair of 9.5 series resistors and a 1:2 transformer. Table-7 Transformer Specifications(1)
Part No. STD Temp. EXT Temp. T1124 T1114
1. Pulse
In T1 mode, only 5.0 V can be selected, 100 lines are driven through a pair of 9.1 series resistors and a 1:2 transformer. In harsh cable environment, series resistors are required to improve the transmit return loss performance and protect the device from surges coupling into the device.
Turns Ratio (Pri: sec 2%) Transmit Receive 1:2CT 1CT:2
Electrical Specification @ 25C OCL @ 25C (mH MIN) LL (H MAX) Transmit Receive Transmit Receive 1.2 1.2 .6 .6
CW/W (pF MAX) Transmit Receive 35 35
Package/Schematic TOU/3
T1124 transformer is recommended to be used in Standard (STD) operating temperature range (0C to 70C), while Pulse T1114 transformer is recommended to be used in Extended (EXT) operating temperature range is -40C to +85C.
2.8
POWER DRIVER FAILURE MONITOR
2.9
TRANSMIT LINE SIDE SHORT CIRCUIT
An internal power Driver Failure Monitor (DFMON), parallel connected with TTIPn and TRINGn, can detect short circuit failure between TTIPn and TRINGn pins. Bit SCPB in register GCF decides whether the output driver short circuit protection is enabled. When the short circuit protection is enabled, the driver output current is limited to a typical value: 180 mAp. Also, register DF, DFI and DFM will be available. When DFMON will detect a short circuit, register DF will be set. With a short circuit failure detected, register DFI will be set and an interrupt will be generated on pin INT.
In E1 or T1 with 5 V VDDT, a pair of 9.5 serial resistors connect with TTIPn and TRINGn pins and limit the output current. In this case, the output current is a limited value which is always lower than the typical line short circuit current 180 mAp, even if the transmit line side is shorted. Refer to Table-6 External Components Values for details.
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2.10 LINE PROTECTION
In transmit side, the Schottky diodes D1~D4 are required to protect the line driver and improve the design robustness. In receive side, the series resistors of 1 k are used to protect the receiver against current surges coupled in the device. The series resistors do not affect the receiver sensitivity, since the receiver impedance is as high as 120 k typically.
2.12 TRANSMIT ALL ONES (TAOS)
In hardware mode, the TAOS mode is set by pulling pin TCLKn high for more than 16 MCLK cycles. In host mode, TAOS mode is set by programming register TAO. In addition, automatic TAOS signals are inserted by setting register ATAO when Loss of Signal occurs. Note that the TAOS generator adopts MCLK as a timing reference. In order to assure that the output frequency is within specified limits, MCLK must have the applicable stability. Refer to Figure-8 TAOS Data Path.
2.11 HITLESS PROTECTION SWITCHING (HPS)
The IDT82V2048L transceivers include an output driver with high impedance feature for T1/E1 redundancy applications. This feature reduces the cost of redundancy protection by eliminating external relays. Details of HPS are described in relative Application Note.
LOS Detector RTIPn RRINGn Peak Detector TTIPn TRINGn Line Driver Waveform Shaper Transmit All Ones Slicer
One of Eight Identical Channels LOSn RCn RDPn RDNn
TCLKn TDPn TDNn
Figure-8 TAOS Data Path
2.13 G.772 MONITORING
The eight channels of IDT82V2048L can all be configured to work as regular transceivers. In applications using only seven channels (channels 1 to 7), channel 0 is configured to non-intrusively monitor any of the other channels' inputs or outputs on the line side. The monitoring is nonintrusive per ITU-T G.772. Figure-9 shows the Monitoring Principle. The receiver path or transmitter path to be monitored is configured by pin MC[3:0] in hardware mode or by PMON in host mode. The signal which is monitored can be observed digitally at the output pin RC0, RDP0 and RDN0. LOS detector is still in use in channel 0 for the monitored signal.
In monitoring mode, a clock and data recovery circuit can be enabled for Remote Loopback operation. In Remote Loopback operation, the signal which is being monitored will be also output on TTIP0 and TRING0 pins. The output signal can then be connected to a standard test equipment for non-intrusive monitoring. RC0 pin will also output the recovered clock (DPLL). The remote loopback is only available in host mode operation. To enable the remote loopback, bit 0 in register RL0 has to be set, and bit 0 in register e-AFE has to be cleared. The register setting are: register RL0 set `01'H, register e-AFE set `FE'H. For normal operation register RL0 has to be set `00H' and register eAFE has to be set `FFH'.
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Channel N ( 7 > N > 1 ) LOS Detector RTIPn RRINGn Peak Detector TTIPn TRINGn Line Driver Waveform Shaper Transmit All Ones TCLKn TDPn TDNn Slicer LOSn RCn RDPn RDNn
G.772 Monitor RTIP0 RRING0 Peak Detector TTIP0 TRING0 Line Driver
Channel 0 LOS Detector Slicer Remote Loopback CDR Remote Loopback Waveform Shaper Transmit All Ones TCLK0 TDP0 TDN0 LOS0 RC0 RDP0 RDN0
Figure-9 Monitoring Principle
2.14 SOFTWARE RESET
Writing register RS will cause software reset by initiating about 1 s reset cycle. This operation set all the registers to their default value.
2.16 POWER DOWN
Each transmit channel will be powered down by pulling pin TCLKn low for more than 64 MCLK cycles (if MCLK is available) or about 30 s (if MCLK is not available). In host mode, each transmit channel will also be powered down by setting bit TPDNn in register e-TPDN to `1'. All the receivers will be powered down when MCLK is low. When MCLK is clocked or high, setting bit RPDNn in register e-RPDN to `1' will configure the corresponding receiver to be powered down.
2.15 POWER ON RESET
During power up, an internal reset signal sets all the registers to default values. The power-on reset takes at least 10 s, starting from when the power supply exceeds 2/3 VDDA.
2.17 INTERFACE WITH 5 V LOGIC
The IDT82V2048L can interface directly with 5 V TTL family devices. The internal input pads are tolerant to 5 V output from TTL and CMOS family devices.
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2.18 HOST INTERFACE
The host interface provides access to read and write the registers in the device. The interface consists of serial host interface and parallel host interface. By pulling pin MODE2 to VDDIO/2 or high, the device can be set to work in serial mode and in parallel mode respectively. In host mode operation, expanded register e-FAE has to be set to `FFH' for proper device operation. See Expanded Register Description on page 28 for details. Table-8 Parallel Host Interface Pins
MODE[2:0] 100 101 110 111
CS SCLK SDI
2.18.1 PARALLEL HOST INTERFACE The interface is compatible with Motorola and Intel host. Pins MODE[1:0] are used to select the operating mode of the parallel host interface. When pin MODE1 is pulled low, the host uses separate address bus and data bus. When high, multiplexed address/data bus is used. When pin MODE0 is pulled low, the parallel host interface is configured for Motorola compatible hosts. When pin MODE0 is pulled high, the parallel host interface is configured for Intel compatible hosts. See Table-1 Pin Description for more details. The host interface pins in each operation mode is tabulated in Table-8:
Host Interface Non-multiplexed Motorola interface Non-multiplexed Intel interface Multiplexed Motorola interface Multiplexed Intel interface
Generic Control, Data and Output Pin CS, ACK, DS, R/W, AS, A[4:0], D[7:0], INT CS, RDY, WR, RD, ALE, A[4:0], D[7:0], INT CS, ACK, DS, R/W, AS, AD[7:0], INT CS, RDY, WR, RD, ALE, AD[7:0], INT
1 R/W A1 A2 A3 A4 A5 A6 A7 D0 D1 D2 D3 D4 D5 D6 D7
2
2
Address/Command Byte SDO High Impedance
Input Data Byte D0 D1 D2 D3 D4 D5 D6 D7 Driven while R/W=1
1. While R/W=1, read from IDT82V2048L; While R/W=0, write to IDT82V2048L. 2. Ignored.
Figure-10 Serial Host Mode Timing 2.18.2 SERIAL HOST INTERFACE By pulling pin MODE2 to VDDIO/2, the device operates in the serial host Mode. In this mode, the registers are accessible through a 16-bit word which contains an 8-bit command/address byte (bit R/W and 5address-bit A1~A5, A6 and A7 bits are ignored) and a subsequent 8-bit data byte (D7~D0), as shown in Figure-10. When bit R/W is set to `1', data is read out from pin SDO. When bit R/W is set to `0', data on pin SDI is written into the register whose address is indicated by address bits A5~A1. Refer to Figure-10 Serial Host Mode Timing.
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2.19 INTERRUPT HANDLING
2.19.1 INTERRUPT SOURCES There are two kinds of interrupt sources: 1. Status change in register LOS. The analog/digital loss of signal detector continuously monitors the received signal to update the specific bit in register LOS which indicates presence or absence of a LOS condition. 2. Status change in register DF. The automatic power driver circuit continuously monitors the output drivers signal to update the specific bit in register DFM which indicates presence or absence of an output driver short circuit condition.
2.19.2 INTERRUPT ENABLE The IDT82V2048L provides a latched interrupt output (INT) and the two kinds of interrupts are all reported by this pin. When the Interrupt Mask register: LOSM and DFM, are set to `1', the Interrupt Status register: LOSI and DFI, are enabled respectively. Whenever there is a transition (`0' to `1' or `1' to `0') in the corresponding status register, the Interrupt Status register will change into `1', which means an interrupt occurs, and there will be a high to low transition on INT pin. An external pull-up resistor of approximately 10 k is required to support the wireOR operation of INT. When any of the two Interrupt Mask registers is set to `0' (the power-on default value is `0'), the corresponding Interrupt Status register is disabled and the transition on status register is ignored. 2.19.3 INTERRUPT CLEARING When an interrupt occurs, the Interrupt Status registers: LOSI and DFI, are read to identify the interrupt source. These registers will be cleared to `0' after the corresponding status registers: LOS and DF are read. The Status registers will be cleared once the corresponding conditions are met. Pin INT is pulled high when there is no pending interrupt left. The interrupt handling in the interrupt service routine is shown in Figure-11.
Interrupt Allowed
No
Interrupt Condition Exist? Yes
Read Interrupt Status Register
Read Corresponding Status Register
Service the Interrupt
Figure-11 Interrupt Service Routine
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3
3.1
PROGRAMMING INFORMATION
REGISTER LIST AND MAP
The Register ADDP, addressed as 11111 or 1F Hex, switches between primary registers bank and expanded registers bank. By setting register ADDP to `AAH', the 5 address bits point to the expanded register bank, that is, 4 expanded registers are available. By clearing register ADDP, the primary registers are available.
There are 18 primary registers (including an Address Pointer Control Register and 4 expanded registers in the device). Whatever the control interface is, 5 address bits are used to set the registers. In non-multiplexed parallel interface mode, the five dedicated address bits are A[4:0]. In multiplexed parallel interface mode, AD[4:0] carries the address information. In serial interface mode, A[5:1] are used to address the register. Table-9 Primary Register List
Address Hex 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F Serial Interface A7-A1 XX00000 XX00001 XX00010 XX00011 XX00100 XX00101 XX00110 XX00111 XX01000 XX01001 XX01010 XX01011 XX01100 XX01101 XX01110 XX01111 XX10000 XX10001 XX10010 XX10011 XX10100 XX10101 XX10110 XX10111 XX11000 XX11001 XX11010 XX11011 XX11100 XX11101 XX11110 XX11111 Parallel Interface A7-A0 XXX00000 XXX00001 XXX00010 XXX00011 XXX00100 XXX00101 XXX00110 XXX00111 XXX01000 XXX01001 XXX01010 XXX01011 XXX01100 XXX01101 XXX01110 XXX01111 XXX10000 XXX10001 XXX10010 XXX10011 XXX10100 XXX10101 XXX10110 XXX10111 XXX11000 XXX11001 XXX11010 XXX11011 XXX11100 XXX11101 XXX11110 XXX11111 Register ID RL0 TAO LOS DF LOSM DFM LOSI DFI RS PMON LAC ATAO GCF TSIA TS OE R/W R R/W R/W R R R/W R/W R R W R/W R/W R/W R/W R/W R/W R/W
3.2
RESERVED AND TEST REGISTERS
Primary Registers, whose address are 01H, 0CH, 13H to 1EH, are reserved. Expanded registers, whose address are 00H, 01H, 05H, 06H, 08H to 0FH, are reserved. Expanded registers, whose address are 10H to 1EH, are used for test and must be set to `0' (default).
Explanation Device ID Register Reserved G.772 Monitoring, Remote Loopback Configuration Register Transmit All Ones Configuration Register Loss of Signal Status Register Driver Fault Status Register LOS Interrupt Mask Register Driver Fault Interrupt Mask Register LOS Interrupt Status Register Driver Fault Interrupt Status Register Software Reset Register Performance Monitor Configuration Register Reserved LOS/AIS Criteria Configuration Register Automatic TAOS Configuration Register Global Configuration Register Indirect Address Register for Transmit Template Select Transmit Template Select Register Output Enable Configuration Register
Reserved
ADDP
R/W
Address pointer control Register for switching between primary register bank and expanded register bank
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Table-10 Expanded (Indirect Address Mode) Register List Address Hex Serial Interface A7-A1 Parallel Interface A7-A0
00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F XX00000 XX00001 XX00010 XX00011 XX00100 XX00101 XX00110 XX00111 XX01000 XX01001 XX01010 XX01011 XX01100 XX01101 XX01110 XX01111 XX10000 XX10001 XX10010 XX10011 XX10100 XX10101 XX10110 XX10111 XX11000 XX11001 XX11010 XX11011 XX11100 XX11101 XX11110 XXX00000 XXX00001 XXX00010 XXX00011 XXX00100 XXX00101 XXX00110 XXX00111 XXX01000 XXX01001 XXX01010 XXX01011 XXX01100 XXX01101 XXX01110 XXX01111 XXX10000 XXX10001 XXX10010 XXX10011 XXX10100 XXX10101 XXX10110 XXX10111 XXX11000 XXX11001 XXX11010 XXX11011 XXX11100 XXX11101 XXX11110 XXX11111 Reserved e-AFE e-RPDN e-TPDN e-EQUA R/W R/W R/W R/W AFE Enable Register Receiver n Powerdown Enable/Disable Register Transmitter n Powerdown Enable/Disable Register Reserved Enable Equalizer Enable/Disable Register Register R/W Explanation
Reserved
Test
XX11111
ADDP
R/W
Address pointer control register for switching between primary register bank and expanded register bank
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Table-11 Primary Register Map
Register Address R/W Default 00H R Default 02H R/W Default 03H R/W Default 04H R Default 05H R Default 06H R/W Default 07H R/W Default 08H R Default 09H R Default 0AH W Default 0BH R/W Default 0DH R/W Default 0EH R/W Default 0FH R/W Default 10 Hex R/W Default Bit 7 ID 7 R 0 R/W 0 TAO 7 R/W 0 LOS 7 R 0 DF 7 R 0 LOSM 7 R/W 0 DFM 7 R/W 0 LOSI 7 R 0 DFI 7 R 0 RS 7 W 1 R/W 0 LAC 7 R/W 0 ATAO 7 R/W 0 R/W 0 R/W 0 Bit 6 ID 6 R 0 R/W 0 TAO 6 R/W 0 LOS 6 R 0 DF 6 R 0 LOSM 6 R/W 0 DFM 6 R/W 0 LOSI 6 R 0 DFI 6 R 0 RS 6 W 1 R/W 0 LAC 6 R/W 0 ATAO 6 R/W 0 R/W 0 R/W 0 Bit 5 ID 5 R 0 R/W 0 TAO 5 R/W 0 LOS 5 R 0 DF 5 R 0 LOSM 5 R/W 0 DFM 5 R/W 0 LOSI 5 R 0 DFI 5 R 0 RS 5 W 1 R/W 0 LAC 5 R/W 0 ATAO 5 R/W 0 SCPB R/W 0 R/W 0 Bit 4 ID 4 R 1 R/W 0 TAO 4 R/W 0 LOS 4 R 0 DF 4 R 0 LOSM 4 R/W 0 DFM 4 R/W 0 LOSI 4 R 0 DFI 4 R 0 RS 4 W 1 R/W 0 LAC 4 R/W 0 ATAO 4 R/W 0 R/W 0 R/W 0 Bit 3 ID 3 R 0 R/W 0 TAO 3 R/W 0 LOS 3 R 0 DF 3 R 0 LOSM 3 R/W 0 DFM 3 R/W 0 LOSI 3 R 0 DFI 3 R 0 RS 3 W 1 MC 3 R/W 0 LAC 3 R/W 0 ATAO 3 R/W 0 R/W 0 R/W 0 Bit 2 ID 2 R 0 R/W 0 TAO 2 R/W 0 LOS 2 R 0 DF 2 R 0 LOSM 2 R/W 0 DFM 2 R/W 0 LOSI 2 R 0 DFI 2 R 0 RS 2 W 1 MC 2 R/W 0 LAC 2 R/W 0 ATAO 2 R/W 0 R/W 0 TSIA 2 R/W 0 Bit 1 ID 1 R 0 R/W 0 TAO 1 R/W 0 LOS 1 R 0 DF 1 R 0 LOSM 1 R/W 0 DFM 1 R/W 0 LOSI 1 R 0 DFI 1 R 0 RS 1 W 1 MC 1 R/W 0 LAC 1 R/W 0 ATAO 1 R/W 0 R/W 0 TSIA 1 R/W 0 Bit 0 ID 0 R 0 RL0 R/W 0 TAO 0 R/W 0 LOS 0 R 0 DF 0 R 0 LOSM 0 R/W 0 DFM 0 R/W 0 LOSI 0 R 0 DFI 0 R 0 RS 0 W 1 MC 0 R/W 0 LAC 0 R/W 0 ATAO 0 R/W 0 R/W 0 TSIA 0 R/W 0
ID
RL0
TAO
LOS
DF
LOSM
DFM
LOSI
DFI
RS
PMON
LAC
ATAO
GCF
TSIA
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Table-11 Primary Register Map (Continued)
Register Address R/W Default 11 Hex R/W Default 12 Hex R/W Default 1F Hex R/W Default Bit 7 R/W 0 OE 7 R/W 0 ADDP 7 R/W 0 Bit 6 R/W 0 OE 6 R/W 0 ADDP 6 R/W 0 Bit 5 R/W 0 OE 5 R/W 0 ADDP 5 R/W 0 Bit 4 R/W 0 OE 4 R/W 0 ADDP 4 R/W 0 Bit 3 R/W 0 OE 3 R/W 0 ADDP 3 R/W 0 Bit 2 TS 2 R/W 0 OE 2 R/W 0 ADDP 2 R/W 0 Bit 1 TS 1 R/W 0 OE 1 R/W 0 ADDP 1 R/W 0 Bit 0 TS 0 R/W 0 OE 0 R/W 0 ADDP 0 R/W 0
TS
OE
ADDP
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Table-12 Expanded (Indirect Address Mode) Register Map
Register Address R/W Default 02H R/W Default 03H R/W Default 04H R/W Default 07H R/W Default 1FH R/W Default Bit 7 AFE 7 R/W 0 RPDN 7 R/W 0 TPDN 7 R/W 0 EQUA 7 R/W 0 ADDP 7 R/W 0 Bit 6 AFE 6 R/W 0 RPDN 6 R/W 0 TPDN 6 R/W 0 EQUA 6 R/W 0 ADDP 6 R/W 0 Bit 5 AFE 5 R/W 0 RPDN 5 R/W 0 TPDN 5 R/W 0 EQUA 5 R/W 0 ADDP 5 R/W 0 Bit 4 AFE 4 R/W 0 RPDN 4 R/W 0 TPDN 4 R/W 0 EQUA 4 R/W 0 ADDP 4 R/W 0 Bit 3 AFE 3 R/W 0 RPDN 3 R/W 0 TPDN 3 R/W 0 EQUA 3 R/W 0 ADDP 3 R/W 0 Bit 2 AFE 2 R/W 0 RPDN 2 R/W 0 TPDN 2 R/W 0 EQUA 2 R/W 0 ADDP 2 R/W 0 Bit 1 AFE 1 R/W 0 RPDN 1 R/W 0 TPDN 1 R/W 0 EQUA 1 R/W 0 ADDP 1 R/W 0 Bit 0 AFE 0 R/W 0 RPDN 0 R/W 0 TPDN 0 R/W 0 EQUA 0 R/W 0 ADDP 0 R/W 0
e-AFE(1)
e-RPDN
e-TPDN
e-EQUA
ADDP
1.
In host mode, register e-AFE has to be set to `FFH' for proper device operation. See e-AFE: AFE Enable Selection Register (R/W, Expanded Address = 02H) on page 28 for more details.
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3.3
3.3.1
REGISTER DESCRIPTION
PRIMARY REGISTERS
ID: Device ID Register (R, Address = 00H)
Symbol ID[7:0] Position ID.7-0 Default 10H Description An 8-bit word is pre-set into the device as the identification and revision number. This number is different with the functional changes and is mask programmed.
RL0: G.772 Monitoring, Remote Loopback Configuration Register (R/W, Address = 02H)
Symbol RL[0] Position RL.7-1 RL.0 Default 0000000 0 Description Reserved 0 = Normal operation. (Default) 1 = Remote loopback enabled.
TAO: Transmit All Ones Configuration Register (R/W, Address = 03H)
Symbol TAO[7:0] Position TAO.7-0 Default 00H 0 = Normal operation. (Default) 1 = Transmit all ones. Description
LOS: Loss of Signal Status Register (R, Address = 04H)
Symbol LOS[7:0] Position LOS.7-0 Default 00H 0 = Normal operation. (Default) 1 = Loss of signal detected. Description
DF: Driver Fault Status Register (R, Address = 05H)
Symbol DF[7:0] Position DF.7-0 Default 00H 0 = Normal operation. (Default) 1 = Driver fault detected. Description
LOSM: Loss of Signal Interrupt Mask Register (R/W, Address = 06H)
Symbol LOSM[7:0] Position LOSM.7-0 Default 00H 0 = LOS interrupt is not allowed. (Default) 1 = LOS interrupt is allowed. Description
DFM: Driver Fault Interrupt Mask Register (R/W, Address = 07H)
Symbol DFM[7:0] Position DFM.7-0 Default 00H 0 = Driver fault interrupt not allowed. (Default) 1 = Driver fault interrupt allowed. Description
LOSI: Loss of Signal Interrupt Status Register (R, Address = 08H)
Symbol LOSI[7:0] Position LOSI.7-0 Default 00H Description 0 = (Default). Or after a LOS read operation. 1 = Any transition on LOSn (Corresponding LOSMn is set to `1').
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DFI: Driver Fault Interrupt Status Register (R, Address = 09H)
Symbol DFI[7:0] Position DFI.7-0 Default 00H Description 0 = (Default). Or after a DF read operation. 1 = Any transition on DFn (Corresponding DFMn is set to `1').
RS: Software Reset Register (W, Address = 0AH)
Symbol RS[7:0] Position RS.7-0 Default FFH Description Writing to this register will not change the content in this register but initiate a 1 s reset cycle, which means all the registers in the device are set to their default values.
PMON: Performance Monitor Configuration Register (R/W, Address = 0BH)
Symbol Position PMON.7-4 Default 0000 0 = Normal operation. (Default) 1 = Reserved. 0000 = Normal operation without monitoring (Default) 0001 = Monitor Receiver 1 0010 = Monitor Receiver 2 0011 = Monitor Receiver 3 0100 = Monitor Receiver 4 0101 = Monitor Receiver 5 0110 = Monitor Receiver 6 0111 = Monitor Receiver 7 1000 = Normal operation without monitoring 1001 = Monitor Transmitter 1 1010 = Monitor Transmitter 2 1011 = Monitor Transmitter 3 1100 = Monitor Transmitter 4 1101 = Monitor Transmitter 5 1110 = Monitor Transmitter 6 1111 = Monitor Transmitter 7 Description
MC[3:0]
PMON.3-0
0000
LAC: LOS/AIS Criteria Configuration Register (R/W, Address = 0DH)
Symbol LAC[7:0] Position LAC.7-0 Default 00H For E1 mode, the criterion is selected as below: 0 = G.775 (Default) 1 = ETSI 300 233 For T1 mode, the criterion meets T1.231. Description
ATAO: Automatic TAOS Configuration Register (R/W, Address = 0EH)
Symbol ATAO[7:0] Position ATAO.7-0 Default 00H Description 0 = No automatic transmit all ones. (Default) 1 = Automatic transmit all ones to the line side during LOS.
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GCF: Global Configuration Register (R/W, Address = 0FH)
Symbol SCPB Position GCF.7-6 GCF.5 GCF.4-0 Default 00 0 00000 0 = Normal operation. 1 = Reserved. 0 = Short circuit protection is enabled. 1 = Short circuit protection is disabled. 0 = Normal operation. 1 = Reserved. Description
TSIA: Indirect Address Register for Transmit Template Select Registers (R/W, Address = 10H)
Symbol Position TSIA.7-3 Default 00000 0 = Normal operation. (Default) 1 = Reserved. 000 = Channel 0 (Default) 001 = Channel 1 010 = Channel 2 011 = Channel 3 100 = Channel 4 101 = Channel 5 110 = Channel 6 111 = Channel 7 Description
TSIA[2:0]
TSIA.2-0
000
TS: Transmit Template Select Register (R/W, Address = 11H)
Symbol Position TS.7-3 Default 00000 Description 0 = Normal operation. (Default) 1 = Reserved. TS[2:0] pins select one of eight built-in transmit template for different applications. TS[2:0] 000 001 010 011 100 101 110 111 Mode E1 Cable Length 75 coaxial cable/120 twisted pair cable. Reserved. T1 T1 T1 T1 T1 0 - 133 ft. 133 - 266 ft. 266 - 399 ft. 399 - 533 ft. 533 - 655 ft.
TS[2-0]
TS.2-0
000
OE: Output Enable Configuration Register (R/W, Address = 12H)
Symbol OE[7:0] Position OE.7-0 Default 00H 0 = Transmit drivers enabled. (Default) 1 = Transmit drivers in high impedance state. Description
ADDP: Address Pointer Control Register (R/W, Address = 1F H)
Symbol ADDP[7:0] Position ADDP.7-0 Default 00H Description Two kinds of configuration in this register can be set to switch between primary register bank and expanded register bank. When power up, the address pointer will point to the top address of primary register bank automatically. 00H = The address pointer points to the top address of primary register bank (default). AAH = The address pointer points to the top address of expanded register bank.
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3.3.2
EXPANDED REGISTER DESCRIPTION
e-AFE: AFE Enable Selection Register (R/W, Expanded Address = 02H)
Symbol AFE[7:0] Position AFE.7-0 Default 00H(1) Description 0 = Reserved (Default) Note: For remote loopback operation in G.772 monitoring mode, bit 0 can be set to '0'. 1 = AFE mode enabled.
1. In host mode, AFE[7:0] bits must be set to `FFH' for normal device operation.
e-RPDN: Receiver n Powerdown Register (R/W, Expanded Address = 03H)
Symbol RPDN[7:0] Position RPDN.7-0 Default 00H 0 = Normal operation. (Default) 1 = Receiver n is powered down. Description
e-TPDN: Transmitter n Powerdown Register (R/W, Expanded Address = 04H)
Symbol TPDN[7:0] Position TPDN.7-0 Default 00H Description 0 = Normal operation. (Default) 1 = Transmitter n is powered down(1) (the corresponding transmit output driver enters a low power high impedance mode).
1. Transmitter n is powered down when either pin TCLKn is pulled low or TPDNn is set to `1'
e-EQUA: Receive Equalizer Enable/Disable Register (R/W, Expanded Address = 07H)
Symbol EQUA[7:0] Position EQUA.7-0 Default 00H Description 0 = Normal operation. (Default) 1 = Equalizer in Receiver n is enabled, which can improve the receive performance when transmission length is more than 200 m.
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4 IEEE STD 1149.1 JTAG TEST ACCESS PORT
The IDT82V2048L supports the digital Boundary Scan Specification as described in the IEEE 1149.1 standards. The boundary scan architecture consists of data and instruction registers plus a Test Access Port (TAP) controller. Control of the TAP is achieved through signals applied to the TMS and TCK pins. Data is shifted into the registers via the TDI pin, and shifted out of the registers via the TDO pin. JTAG test data are clocked at a rate determined by JTAG test clock.
The JTAG boundary scan registers includes BSR (Boundary Scan Register), IDR (Device Identification Register), BR (Bypass Register) and IR (Instruction Register). These will be described in the following pages. Refer to Figure-12 for architecture.
4.1 JTAG INSTRUCTIONS AND INSTRUCTION REGISTER (IR)
The IR with instruction decode block is used to select the test to be executed or the data register to be accessed or both. The instructions are shifted in LSB first to this 3-bit register. See Table-13 Instruction Register Description on page 30 for details of the codes and the instructions related.
Digital output pins
Digital input pins
parallel latched output
BSR (Boundary Scan Register)
IDR (Device Identification Register) TDI BR (Bypass Register)
MUX
MUX
IR (Instruction Register)
TDO
Control<6:0> TMS TRST TCK TAP (Test Access Port) Controller Select High-Z Enable
Figure-12 JTAG Architecture
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Table-13 Instruction Register Description
IR Code Instruction Comments The external test instruction allows testing of the interconnection to other devices. When the current instruction is the EXTEST instruction, the boundary scan register is placed between TDI and TDO. The signal on the input pins can be sampled by loading the boundary scan register using the Capture-DR state. The sampled values can then be viewed by shifting the boundary scan register using the Shift-DR state. The signal on the output pins can be controlled by loading patterns shifted in through input TDI into the boundary scan register using the Update-DR state. The sample instruction samples all the device inputs and outputs. For this instruction, the boundary scan register is placed between TDI and TDO. The normal path between IDT82V2048L logic and the I/O pins is maintained. Primary device inputs and outputs can be sampled by loading the boundary scan register using the Capture-DR state. The sampled values can then be viewed by shifting the boundary scan register using the Shift-DR state. The identification instruction is used to connect the identification register between TDI and TDO. The device's identification code can then be shifted out using the Shift-DR state. The bypass instruction shifts data from input TDI to output TDO with one TCK clock period delay. The instruction is used to bypass the device.
000
Extest
100
Sample/Preload
110 111
Idcode Bypass
Table-14 Device Identification Register Description
Bit No. 0 1~11 12~27 28~31 Comments Set to `1' Producer Number Part Number Device Revision
4.2.2
BYPASS REGISTER (BR)
The BR consists of a single bit. It can provide a serial path between the TDI input and TDO output, bypassing the BSR to reduce test access times. 4.2.3 BOUNDARY SCAN REGISTER (BSR) The BSR can apply and read test patterns in parallel to or from all the digital I/O pins. The BSR is a 98 bits long shift register and is initialized and read using the instruction EXTEST or SAMPLE/PRELOAD. Each pin is related to one or more bits in the BSR. Please refer to Table-15 for details of BSR bits and their functions.
4.2
JTAG DATA REGISTER
4.2.1 DEVICE IDENTIFICATION REGISTER (IDR) The IDR can be set to define the producer number, part number and the device revision, which can be used to verify the proper version or revision number that has been used in the system under test. The IDR is 32 bits long and is partitioned as in Table-14. Data from the IDR is shifted out to TDO LSB first. Table-15 Boundary Scan Register Description
Bit No. 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Bit Symbol POUT0 PIN0 POUT1 PIN1 POUT2 PIN2 POUT3 PIN3 POUT4 PIN4 POUT5 PIN5 POUT6 PIN6 POUT7 PIN7 Pin Signal D0 D0 D1 D1 D2 D2 D3 D3 D4 D4 D5 D5 D6 D6 D7 D7 Type I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O Comments
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Table-15 Boundary Scan Register Description (Continued)
Bit No. 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 Bit Symbol PIOS TCLK1 TDP1 TDN1 RC1 RDP1 RDN1 HZEN1 LOS1 TCLK0 TDP0 TDN0 RC0 RDP0 RDN0 HZEN0 LOS0 MODE1 LOS3 RDN3 RDP3 HZEN3 RC3 TDN3 TDP3 TCLK3 LOS2 RDN2 RDP2 HZEN2 RC2 TDN2 TDP2 TCLK2 INT ACK SDORDYS WRB RDB ALE Pin Signal N/A TCLK1 TDP1 TDN1 RC1 RDP1 RDN1 N/A LOS1 TCLK0 TDP0 TDN0 RC0 RDP0 RDN0 N/A LOS0 MODE1 LOS3 RDN3 RDP3 N/A RC3 TDN3 TDP3 TCLK3 LOS2 RDN2 RDP2 N/A RC2 TDN2 TDP2 TCLK2 INT ACK N/A DS R/W ALE Type I I I O O O O I I I O O O O I O O O O I I I O O O O I I I O O I I I Control pin ACK. When `0', the output is enabled on pin ACK. When `1', the pin is in high impedance. Controls pin RDP2, RDN2 and RC2. When `0', the outputs are enabled on the pins. When `1', the pins are in high impedance. Controls pin RDP3, RDN3 and RC3. When `0', the outputs are enabled on the pins. When `1', the pins are in high impedance. Controls pin RDP0, RDN0 and RC0. When `0', the outputs are enabled on the pins. When `1', the pins are in high impedance. Controls pin RDP1, RDN1 and RC1. When `0', the outputs are enabled on the pins. When `1', the pins are in high impedance. Comments Controls pins D[7:0]. When `0', the pins are configured as outputs. The output values to the pins are set in POUT 7~0. When `1', the pins are in high impedance. The input values to the pins are read in PIN 7~0.
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Table-15 Boundary Scan Register Description (Continued)
Bit No. 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 Bit Symbol CSB MODE0 TCLK5 TDP5 TDN5 RC5 RDP5 RDN5 HZEN5 LOS5 TCLK4 TDP4 TDN4 RC4 RDP4 RDN4 HZEN4 LOS4 OE CLKE LOS7 RDN7 RDP7 HZEN7 RC7 TDN7 TDP7 TCLK7 LOS6 RDN6 RDP6 HZEN6 RC6 TDN6 TDP6 TCLK6 MCLK MODE2 A4 A3 A2 A1 A0 Pin Signal CS MODE0 TCLK5 TDP5 TDN5 RC5 RDP5 RDN5 N/A LOS5 TCLK4 TDP4 TDN4 RC4 RDP4 RDN4 N/A LOS4 OE CLKE LOS7 RDN7 RDP7 N/A RC7 TDN7 TDP7 TCLK7 LOS6 RDN6 RDP6 N/A RC6 TDN6 TDP6 TCLK6 MCLK MODE2 A4 A3 A2 A1 A0 Type I I I I I O O O O I I I O O O O I I O O O O I I I O O O O I I I I I I I I I I Controls pin RDP6, RDN6 and RC6. When `0', the outputs are enabled on the pins. When `1', the pins are in high impedance. Controls pin RDP7, RDN7 and RC7. When `0', the outputs are enabled on the pins. When `1', the pins are in high impedance. Controls pin RDP4, RDN4 and RC4. When `0', the outputs are enabled on the pins. When `1', the pins are in high impedance. Comments
Controls pin RDP5, RDN5 and RC5. When `0', the outputs are enabled on the pins. When `1', the pins are in high impedance.
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4.3
The TAP controller is a 16-state synchronous state machine. Figure13 shows its state diagram A description of each state follows. Note that the figure contains two main branches to access either the data or Table-16 TAP Controller State Description
State
TEST ACCESS PORT CONTROLLER
instruction registers. The value shown next to each state transition in this figure states the value present at TMS at each rising edge of TCK. Refer to Table-16 for details of the state description.
Description In this state, the test logic is disabled. The device is set to normal operation. During initialization, the device initializes the instruction register with the IDCODE instruction. Regardless of the original state of the controller, the controller enters the Test-Logic-Reset state when the TMS input is held high for at least 5 rising edges of TCK. The controller remains in this state while TMS is high. The device processor automatically enters this state at power-up. This is a controller state between scan operations. Once in this state, the controller remains in the state as long as TMS is held low. The instruction register and all test data registers retain their previous state. When TMS is high and a rising edge is applied to TCK, the controller moves to the Select-DR state. This is a temporary controller state and the instruction does not change in this state. The test data register selected by the current instruction retains its previous state. If TMS is held low and a rising edge is applied to TCK when in this state, the controller moves into the Capture-DR state and a scan sequence for the selected test data register is initiated. If TMS is held high and a rising edge applied to TCK, the controller moves to the Select-IR-Scan state. In this state, the Boundary Scan Register captures input pin data if the current instruction is EXTEST or SAMPLE/PRELOAD. The instruction does not change in this state. The other test data registers, which do not have parallel input, are not changed. When the TAP controller is in this state and a rising edge is applied to TCK, the controller enters the Exit1-DR state if TMS is high or the Shift-DR state if TMS is low. In this controller state, the test data register connected between TDI and TDO as a result of the current instruction shifts data on stage toward its serial output on each rising edge of TCK. The instruction does not change in this state. When the TAP controller is in this state and a rising edge is applied to TCK, the controller enters the Exit1-DR state if TMS is high or remains in the Shift-DR state if TMS is low. This is a temporary state. While in this state, if TMS is held high, a rising edge applied to TCK causes the controller to enter the Update-DR state, which terminates the scanning process. If TMS is held low and a rising edge is applied to TCK, the controller enters the Pause-DR state. The test data register selected by the current instruction retains its previous value and the instruction does not change during this state. The pause state allows the test controller to temporarily halt the shifting of data through the test data register in the serial path between TDI and TDO. For example, this state could be used to allow the tester to reload its pin memory from disk during application of a long test sequence. The test data register selected by the current instruction retains its previous value and the instruction does not change during this state. The controller remains in this state as long as TMS is low. When TMS goes high and a rising edge is applied to TCK, the controller moves to the Exit2-DR state. This is a temporary state. While in this state, if TMS is held high, a rising edge applied to TCK causes the controller to enter the Update-DR state, which terminates the scanning process. If TMS is held low and a rising edge is applied to TCK, the controller enters the Shift-DR state. The test data register selected by the current instruction retains its previous value and the instruction does not change during this state. The Boundary Scan Register is provided with a latched parallel output to prevent changes while data is shifted in response to the EXTEST and SAMPLE/PRELOAD instructions. When the TAP controller is in this state and the Boundary Scan Register is selected, data is latched into the parallel output of this register from the shift-register path on the falling edge of TCK. The data held at the latched parallel output changes only in this state. All shift-register stages in the test data register selected by the current instruction retain their previous value and the instruction does not change during this state. This is a temporary controller state. The test data register selected by the current instruction retains its previous state. If TMS is held low and a rising edge is applied to TCK when in this state, the controller moves into the Capture-IR state, and a scan sequence for the instruction register is initiated. If TMS is held high and a rising edge is applied to TCK, the controller moves to the Test-Logic-Reset state. The instruction does not change during this state. In this controller state, the shift register contained in the instruction register loads a fixed value of `100' on the rising edge of TCK. This supports fault-isolation of the board-level serial test data path. Data registers selected by the current instruction retain their value and the instruction does not change during this state. When the controller is in this state and a rising edge is applied to TCK, the controller enters the Exit1IR state if TMS is held high, or the Shift-IR state if TMS is held low. In this state, the shift register contained in the instruction register is connected between TDI and TDO and shifts data one stage towards its serial output on each rising edge of TCK. The test data register selected by the current instruction retains its previous value and the instruction does not change during this state. When the controller is in this state and a rising edge is applied to TCK, the controller enters the Exit1-IR state if TMS is held high, or remains in the Shift-IR state if TMS is held low.
Test Logic Reset
Run-Test/Idle
Select-DR-Scan
Capture-DR
Shift-DR
Exit1-DR
Pause-DR
Exit2-DR
Update-DR
Select-IR-Scan
Capture-IR
Shift-IR
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Table-16 TAP Controller State Description (Continued)
State Exit1-IR Description This is a temporary state. While in this state, if TMS is held high, a rising edge applied to TCK causes the controller to enter the Update-IR state, which terminates the scanning process. If TMS is held low and a rising edge is applied to TCK, the controller enters the Pause-IR state. The test data register selected by the current instruction retains its previous value and the instruction does not change during this state. The pause state allows the test controller to temporarily halt the shifting of data through the instruction register. The test data register selected by the current instruction retains its previous value and the instruction does not change during this state. The controller remains in this state as long as TMS is low. When TMS goes high and a rising edge is applied to TCK, the controller moves to the Exit2-IR state. This is a temporary state. While in this state, if TMS is held high, a rising edge applied to TCK causes the controller to enter the Update-IR state, which terminates the scanning process. If TMS is held low and a rising edge is applied to TCK, the controller enters the Shift-IR state. The test data register selected by the current instruction retains its previous value and the instruction does not change during this state. The instruction shifted into the instruction register is latched into the parallel output from the shift-register path on the falling edge of TCK. When the new instruction has been latched, it becomes the current instruction. The test data registers selected by the current instruction retain their previous value.
Pause-IR
Exit2-IR
Update-IR
1
Test-logic Reset 0
0 Run Test/Idle
1
Select-DR 0 1 Capture-DR 0
1
Select-IR 0 1 Capture-IR 0
1
0 Shift-DR 1 Exit1-DR 0 0 Pause-DR 1 0 Exit2-DR 1 Update-DR 1 0 0 Pause-IR 1 Exit2-IR 1 Update-IR 1 0 1 Shift-IR 1 Exit1-IR 0
0
1
0
Figure-13 JTAG State Diagram
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ABSOLUTE MAXIMUM RATING
Symbol VDDA, VDDD VDDIO0, VDDIO1 VDDT0-7 Core Power Supply I/O Power Supply Transmit Power Supply Input Voltage, any digital pin Vin Input Voltage(1), RTIPn pins and RRINGn pins ESD Voltage, any pin(2) Transient Latch-up Current, any pin Iin Pd Ts Input Current, any digital pin(3) DC Input Current, any analog pin(3) Maximum Power Dissipation in package Storage Temperature -65 Parameter Min -0.5 -0.5 -0.5 GND-0.5 GND-0.5 2000 100 -10 10 100 1.6 +150 Max 4.0 4.0 7.0 5.5 VDDA+ 0.5 VDDD+ 0.5 Unit V V V V V V V mA mA mA W C
CAUTION: Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
1.
Referenced to ground Constant input current
2. Human body model 3.
RECOMMENDED OPERATING CONDITIONS
Symbol VDDA, VDDD VDDIO VDDT(1) Core Power Supply I/O Power Supply Transmitter Supply 3.3 V 5V TA RL IVDD IVDDIO IVDDT Ambient Operating Temperature Output load at TTIPn pins and TRINGn pins Average Core Power Supply Current(2) I/O Power Supply Current(3) Average transmitter power supply current, T1 mode 50% ones density data: 100% ones density data:
(2),(4),(5)
Parameter
Min 3.13 3.13 3.13 4.75 -40 25
Typ 3.3 3.3 3.3 5.0 25 55 15
Max 3.47 3.47 3.47 5.25 85 65 25 230 440
Unit V V V V C mA mA mA mA
1. T1 is only 5V VDDT. 2. 3. 4. 5.
Maximum power and current consumption over the full operating temperature and power supply voltage range. Includes all channels. Digital output is driving 50 pF load, digital input is within 10% of the supply rails. T1 maximum values measured with maximum cable length (LEN = 111). Typical values measured with typical cable length (LEN = 101). Power consumption includes power absorbed by line load and external transmitter components.
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POWER CONSUMPTION
Symbol Parameter E1, 3.3 V, 75 Load 50% ones density data: 100% ones density data: E1, 3.3 V, 120 Load 50% ones density data: 100% ones density data: E1, 5.0 V, 75 Load 50% ones density data: 100% ones density data: E1, 5.0 V, 120 Load 50% ones density data: 100% ones density data: T1, 5.0 V, 100 Load(3) 50% ones density data: 100% ones density data:
2. Power consumption includes power absorbed by line load and external transmitter components. 3.
LEN 000 000 000 000 000 000 000 000 101 111
Min -
Typ 662 1100 576 930 910 1585 785 1315 1185 2395
Max(1)(2) 1177 992 1690 1410 2670
Unit mW mW mW mW mW mW mW mW mW mW
1. Maximum power and current consumption over the full operating temperature and power supply voltage range. Includes all channels.
DC CHARACTERISTICS
Symbol VIL Input Low Level Voltage
T1 maximum values measured with maximum cable length (LEN = 111). Typical values measured with typical cable length (LEN = 101).
Parameter MODE2 and Dn pins
Min
Typ
1 -3
Max VDDIO-0.2 0.8
Unit V V V V
VIM VIH
All other digital inputs pins Input Mid Level Voltage MODE2 and Dn pins Input High Voltage MODE2 and Dn pins All other digital inputs pins
2 -- VDDIO+ 0.2 3 1 -3
VDDIO+0.2
1 -- VDDIO 2
2 -- VDDIO-0.2 3
2.0 0.4 2.4 1.33 1.4 VDDIO 1.47 50 50 50 10 10
VOL VOH VMA IH IL II
Output Low level Voltage(1) (Iout = 1.6 mA) Output High level Voltage(1) (Iout = 400 A) Analog Input Quiescent Voltage (RTIPn/RRINGn pin while floating) Input High Level Current (MODE2 and Dn pins) Input Low Level Current (MODE2 and Dn pins) Input Leakage Current TMS, TDI and TRST pins All other digital input pins High Impedance Leakage Current Output High Impedance on TTIPn and TRINGn pins
V V V V A A A A A k
IZL ZOH
1.
-10 -10 150
Output drivers will output CMOS logic levels into CMOS loads.
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TRANSMITTER CHARACTERISTICS
Symbol Vo-p Output Pulse Amplitudes E1, 75 load E1, 120 load T1, 100 load Zero (space) Level E1, 75 load E1, 120 load T1, 100 load Transmit Amplitude Variation with supply Difference between pulse sequences for 17 consecutive pulses TPW Output Pulse Width at 50% of nominal amplitude E1: T1: Ratio of the amplitudes of Positive and Negative Pulses at the center of the pulse interval RTX Transmit Return Loss
(2) (1)
Parameter
Min 2.14 2.7 2.4 -0.237 -0.3 -0.15 -1
Typ 2.37 3.0 3.0
Max 2.6 3.3 3.6 0.237 0.3 0.15 +1 200
Unit V V V V V V % mV ns ns
VO-S
232 338 0.95 15 15 15 15 15 15 15 15 15
244 350
256 362 1.05
E1, 75
E1, 120 T1 (VDDT = 5 V) Td ISC
2.
51 kHz - 102 kHz 102 kHz - 2.048 MHz 2.048 MHz - 3.072 MHz 51 kHz - 102 kHz 102 kHz - 2.048 MHz 2.048 MHz - 3.072 MHz 51 kHz - 102 kHz 102 kHz - 2.048 MHz 2.048 MHz - 3.072 MHz
dB dB dB dB dB dB dB dB dB 3 180 U.I. mAp
Transmit Path Delay Line Short Circuit Current (3)
1. E1: measured at the line output ports; T1: measured at the DSX
Test at IDT82V2048L evaluation board
3. Measured on device, between TTIPn and TRINGn
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RECEIVER CHARACTERISTICS
Symbol ATT IA SIR SRE Input Amplitude Signal to Interference Ratio Margin Data Slicer Threshold Analog Loss Of Signal Declare/Clear: Allowable consecutive zeros before LOS E1, G.775: E1, ETSI 300 233: T1, T1.231-1993 LOS Reset Clock Recovery Mode JRXp-p Peak to Peak Intrinsic Receive Jitter (JA disabled) E1 (wide band): T1 (wide band): Receiver Differential Input Impedance Receiver Common Mode Input Impedance to GND Receive Return Loss 51 kHz - 102 kHz 102 kHz - 2.048 MHz 2.048 MHz - 3.072 MHz Receive Path Delay
1. E1: per G.703, O.151 @ 6 dB cable attenuation. T1: @ 655 ft. of 22 ABAM cable 2.
Parameter Permissible Cable Attenuation (E1: @ 1024 kHz, T1: @ 772 kHz)
Min 0.1
Typ
Max 15 0.9
Unit dB Vp dB % mV
(1)
-15 50 150
Data Decision Threshold (refer to peak input voltage)
(2)
120/150
200/250 32 2048 175
280/350
mVp
12.5 0.0625 0.0625 120 10 20 20 20 3
% ones U.I. U.I. k k dB dB dB U.I.
ZDM ZCM RRX
Measured on device, between RTIPn and RRINGn, all ones signal
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TRANSCEIVER TIMING CHARACTERISTICS
Symbol MCLK Frequency E1: T1: MCLK Tolerance MCLK Duty Cycle Transmit Path TCLK Frequency E1: T1: TCLK Tolerance TCLK Duty Cycle t1 t2 Transmit Data Setup Time Transmit Data Hold Time Delay time of OE low to driver High Impedance Delay time of TCLK low to driver High Impedance Receive Path t4 RDN/RDP Pulse Width(1) E1: T1: t5 t6 t7
1. 0 dB cable loss 2.
Parameter
Min
Typ 2.048 1.544
Max
Unit MHz MHz
-100 40
100 60
ppm %
2.048 1.544 -50 10 40 40 1 40 44 48 +50 90
MHz MHz ppm % ns ns s s
200 300
(2)
244 324 40 14 12
ns ns ns ns ns
RX Data Prop. Delay(2) Receive Rise Time Receive Fall Time(2)
15 pF load
39
IDT82V2048L OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
INDUSTRIAL TEMPERATURE RANGES
TCLKn
t1
t2
TDPn TDNn
Figure-14 Transmit System Interface Timing
RTIPn, RRINGn t5 t4
t6
t7
RDPn (CLKE = 1)
t5
t4
t6
t7
RDNn (CLKE = 1)
t5 t4 t6 t7
RDPn (CLKE = 0)
t5 t4 t6 t7
RDNn (CLKE = 0) t4 t4 t6 t7 t4
XOR, RDPn + RDNn
Figure-15 Receive System Interface Timing
40
IDT82V2048L OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
INDUSTRIAL TEMPERATURE RANGES
JTAG TIMING CHARACTERISTICS
Symbol t1 t2 t3 t4 TCK Period TMS to TCK setup Time TDI to TCK Setup Time TCK to TMS Hold Time TCK to TDI Hold Time TCK to TDO Delay Time Parameter Min 200 50 50 100 Typ Max Unit ns ns ns ns Comments
t1 TCK
t2 TMS
t3
TDI t4
TDO
Figure-16 JTAG Interface Timing
41
IDT82V2048L OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
INDUSTRIAL TEMPERATURE RANGES
PARALLEL HOST INTERFACE TIMING CHARACTERISTICS
INTEL MODE READ TIMING CHARACTERISTICS
Symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16
1.
Parameter Active RD Pulse Width Active CS to Active RD Setup Time Inactive RD to Inactive CS Hold Time Valid Address to Inactive ALE Setup Time (in Multiplexed Mode) Invalid RD to Address Hold Time (in Non-Multiplexed Mode) Active RD to Data Output Enable Time Inactive RD to Data High Impedance Delay Time Active CS to RDY delay time Inactive CS to RDY High Impedance Delay Time Inactive RD to Inactive INT Delay Time Address Latch Enable Pulse Width (in Multiplexed Mode) Address Latch Enable to RD Setup Time (in Multiplexed Mode) Address Setup time to Valid Data Time (in Non-Multiplexed Mode) Inactive RD to Active RDY Delay Time Active RD to Active RDY Delay Time Inactive ALE to Address Hold Time (in Multiplexed Mode)
Min 90 0 0 5 0 7.5 7.5 6 6 10 0 18 10 30 5
Typ
Max
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Comments
(1)
15 15 12 12 20
32 15 85
The t1 is determined by the start time of the valid data when the RDY signal is not used.
42
IDT82V2048L OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
INDUSTRIAL TEMPERATURE RANGES
CS RD ALE(=1) A[4:0]
t2 t1
t3
t13 ADDRESS t6 t7 DATA OUT t8 t14 t15
t5
D[7:0]
t9
RDY t10 INT
Figure-17 Non-Multiplexed Intel Mode Read Timing
CS RD t11 ALE
t2 t1 t12 t16 t4 t6 DATA OUT t14 t7
t3
t13
AD[7:0]
ADDRESS t8
t9
RDY t15 INT t10
Figure-18 Multiplexed Intel Mode Read Timing
43
IDT82V2048L OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
INTEL MODE WRITE TIMING CHARACTERISTICS
INDUSTRIAL TEMPERATURE RANGES
Symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15
Parameter Active WR Pulse Width Active CS to Active WR Setup Time Inactive WR to Inactive CS Hold Time Valid Address to Latch Enable Setup Time (in Multiplexed Mode) Invalid WR to Address Hold Time (in Non-Multiplexed Mode) Valid Data to Inactive WR Setup Time Inactive WR to Data Hold Time Active CS to Inactive RDY Delay Time Active WR to Active RDY Delay Time Inactive WR to Inactive RDY Delay Time Invalid CS to RDY High Impedance Delay Time Address Latch Enable Pulse Width (in Multiplexed Mode) Inactive ALE to WR Setup Time (in Multiplexed Mode) Inactive ALE to Address hold time (in Multiplexed Mode) Address setup time to Inactive WR time (in Non-Multiplexed Mode)
Min 90 0 0 5 2 5 10 6 30 10 6 10 0 5 5
Typ
Max
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Comments
(1)
12 85 15 12
1. The t1 can be 15 ns when RDY signal is not used.
CS t2 WR ALE(=1) t15 A[4:0] ADDRESS t6 D[7:0] t8 RDY t9 t7 t5 t1 t3
WRITE DATA t10 t11
Figure-19 Non-Multiplexed Intel Mode Write Timing
t2 CS WR t12 ALE t4 AD[7:0] t8 RDY t14 t6 t7 t13 t1
t3
ADDRESS t9
WRITE DATA t11 t10
Figure-20 Multiplexed Intel Mode Write Timing
44
IDT82V2048L OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
MOTOROLA MODE READ TIMING CHARACTERISTICS
INDUSTRIAL TEMPERATURE RANGES
Symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14
Parameter Active DS Pulse Width Active CS to Active DS Setup Time Inactive DS to Inactive CS Hold Time Valid R/W to Active DS Setup Time Inactive DS to R/W Hold Time Valid Address to Active DS Setup Time (in Non-Multiplexed Mode) Active DS to Address Hold Time (in Non-Multiplexed Mode) Active DS to Data Valid Delay Time (in Non-Multiplexed Mode) Active DS to Data Output Enable Time Inactive DS to Data High Impedance Delay Time Active DS to Active ACK Delay Time Inactive DS to Inactive ACK Delay Time Inactive DS to Invalid INT Delay Time Active AS to Active DS Setup Time (in Multiplexed Mode)
Min 90 0 0 0 0.5 5 10 20 7.5 7.5 30 10 5
Typ
Max
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Comments
(1)
35 15 15 85 15 20
1. The t1 is determined by the start time of the valid data when the ACK signal is not used.
CS t4 R/W t2 DS ALE(=1) A[4:0] D[7:0] t9 ACK INT t11 t13 t6 t7 t8 DATA OUT t12 t10 t1 t3 t5
ADDRESS
Figure-21 Non-Multiplexed Motorola Mode Read Timing
CS t2 R/W t4 DS t14 AS t6 AD[7:0] ACK t13 INT t7 ADDRESS t11 t8 t9 DATA OUT t12 t1 t5 t3
t10
Figure-22 Multiplexed Motorola Mode Read Timing
45
IDT82V2048L OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
MOTOROLA MODE WRITE TIMING CHARACTERISTICS
INDUSTRIAL TEMPERATURE RANGES
Symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13
Parameter Active DS Pulse Width Active CS to Active DS Setup Time Inactive DS to Inactive CS Hold Time Valid R/W to Active DS Setup Time Inactive DS to R/W Hold Time Valid Address to Active DS Setup Time (in Non-Multiplexed Mode) Valid DS to Address Hold Time (in Non-Multiplexed Mode) Valid Data to Inactive DS Setup Time Inactive DS to Data Hold Time Active DS to Active ACK Delay Time Inactive DS to Inactive ACK Delay Time Active AS to Active DS (in Multiplexed Mode) Inactive DS to Inactive AS Hold Time (in Multiplexed Mode)
Min 90 0 0 10 0 10 10 5 10 30 10 0 15
Typ
Max
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns
Comments
(1)
85 15
1. The t1 can be 15ns when the ACK signal is not used.
CS t4 R/W t2 DS ALE(=1) A[4:0] D[7:0] t10 ACK t6 t7 t8 t9 t1 t3 t5
ADDRESS WRITE DATA t11
Figure-23 Non-Multiplexed Motorola Mode Write Timing
CS t2 R/W t4 DS t12 AS t6 AD[7:0] ACK t7 t10 t8 WRITE DATA t11 t9 t13 t1 t5 t3
ADDRESS
Figure-24 Multiplexed Motorola Mode Writing Timing
46
IDT82V2048L OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
SERIAL HOST INTERFACE TIMING CHARACTERISTICS
INDUSTRIAL TEMPERATURE RANGES
Symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11
Parameter SCLK High Time SCLK Low Time Active CS to SCLK Setup Time Last SCLK Hold Time to Inactive CS Time CS Idle Time SDI to SCLK Setup Time SCLK to SDI Hold Time Rise/Fall Time (any pin) SCLK Rise and Fall Time SCLK to SDO Valid Delay Time SCLK Falling Edge to SDO High Impedance Hold Time (CLKE = 0) or CS Rising Edge to SDO High Impedance Hold Time (CLKE = 1)
Min 25 25 10 50 50 5 5
Typ
Max
Unit ns ns ns ns ns ns ns ns ns ns ns
Comments
25 100
100 50 35
Load = 50 pF
CS t3 SCLK t6 SDI LSB CONTROL BYTE t7 LSB DATA BYTE t7 MSB t1 t2 t4 t5
Figure-25 Serial Interface Write Timing
1 SCLK t10 CS SDO 0 1 2 3 4 5 6 t11 7 t4 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Figure-26 Serial Interface Read Timing with CLKE = 0
1 SCLK CS SDO t10 0 1 2 3 4 5 6 t4 t11 7 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Figure-27 Serial Interface Read Timing with CLKE = 1
47
IDT82V2048L OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
INDUSTRIAL TEMPERATURE RANGES
ORDERING INFORMATION
IDT XXXXXXX Device Type XX Package X Process/ Temperature Range
Blank BB BBG DA DAG
Industrial (-40 C to + 85 C) Plastic Ball Grid Array (PBGA, BB160) Green Plastic Ball Grid Array (PBGA, BBG160) Thin Quad Flatpack (TQFP, DA144) Green Thin Quad Flatpack (TQFP, DAG144)
82V2048L T1/E1 Short Haul Analog Front End
DATASHEET DOCUMENT HISTORY
07/29/2005 pgs. 1, 4, 5, 7 to 10, 13, 15 to 17, 19, 20, 22, 23, 25, 25, 28, 32, 35, 37 to 40, 43 to 47
CORPORATE HEADQUARTERS 6024 Silver Creek Valley Road San Jose, CA 95138 www.idt.com
48
for SALES: 1-800-345-7015 or 408-284-8200 fax: 408-284-2775
for Tech Support: 408-360-1552 email:telecomhelp@idt.com
IDT and the IDT logo are trademarks of Integrated Device Technology, Inc.


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